Home > ǰ > ö > Ʈ ҽ ö
 
 


 

 
Ʈ ҽ ö

ǰ ý ҿ Ʈ ҽ ö ⺻

1. SMD, Wire bonding, Ball attach, Die attach, Encapsulation óϴ ö ġ̴.
2. ö ġ ܺ ġϰ ǰ ܺ ϸ鼭 óȴ.
3. óǴ ӵ ǰ ٸ.
 
Ư¡
High Density Plasma -  е ϴ
Etching and Modification -ǥ鰳. Ī
Effective for 3 Dimensional - ȴ.
Trouble Free - Ʈ
Lowest Running cost ? Ƿ
Damage Free ? ƮӰ Ƿ ǰ .
High Speed ? ó ӵ
Inorganics Remove - ǥ Ŵ Ҽ ⹰ ó ϴ.
 
ǰ԰
1. óũ : Max. 20 mm
2. óӵ : 3 m/min
3. Power : AC 220V 1KW
4. Gas : CDA, CDA + Ar, O2 + Ar
 

, , SMD, ǰ , ,Wire bonding, Ball attach, Die attach, Encapsulation, ITO/ATO, ܵ , , ,
: Ag, Ni, Cu, SUS, ׳׽ , PET, PMMA, PI, ITO, ATO ڸ , GaAs Si ݵü
: SMD, BGA, COF, TAB, COG, BGA